19th International CODATA Conference
Category:
Interoperability

Experimental Results of the Surface Tension and Density for Data Base of Pb- free Soldering Materials

Z. Moser, W. Gasior and A. Debski
Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Poland


Physical properties of soldering materials : surface tension and interfacial tension play a significant role in modeling of Pb-free soldering materials as being directly connected with wettability. Surface tension can be measured for instance, by the maximum bubble pressure method or calculated by modeling based on thermodynamic parameters, while the interfacial tension is one of properties obtained in meniscographic studies in addition to wetting time, wetting force and contact angles. This abstract focuses on surface tension and density data of pure components, binary and ternary alloys mainly based on Sn and used for the computer data base SURDAT of physical properies of the lead-free soldering materials.