19th International CODATA Conference
Category:
Experimental Results
of the Surface Tension and Density for Data Base of Pb- free Soldering Materials
Z. Moser, W. Gasior and A. Debski
Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Poland
Physical properties of soldering materials : surface tension and interfacial
tension play a significant role in modeling of Pb-free soldering materials as
being directly connected with wettability. Surface tension can be measured for
instance, by the maximum bubble pressure method or calculated by modeling based
on thermodynamic parameters, while the interfacial tension is one of properties
obtained in meniscographic studies in addition to wetting time, wetting force
and contact angles. This abstract focuses on surface tension and density data
of pure components, binary and ternary alloys mainly based on Sn and used for
the computer data base SURDAT of physical properies of the lead-free soldering
materials.